Call for Artifacts

Overview

The SIGCOMM 2026 conference's artifact evaluation process is open to accepted papers at the SIGCOMM 2026 conference, to facilitate the public distribution of data, hardware, software, survey results, proofs, models, test suites, benchmarks, and other artifacts associated with a paper available for other researchers' use. Artifact evaluation also intends to publicly recognize authors' efforts in preparing artifacts, as well as to help improve those artifacts before their broader distribution.

Important Dates

Announcement of Call for ArtifactsJuly 2, 2026
Artifact registration deadlineAugust 8, 2026
Artifact submission deadlineSeptember 4, 2026
Reviews availableOctober 11, 2026, at 7:59:59 AM EDT
Author response periodTBD
Notification to authorsTBD

Artifact Review and Badging

At artifact submission time, the authors will choose the criteria by which their artifacts will be evaluated. Based on ACM's guidelines, the SIGCOMM 2026 conference will award two separate badges to a paper. An artifact can meet the criteria of one or both of the following badges:



When the AEC judges that an artifact meets the criteria for one or both of the badges listed above, those badges will appear on the final version of the associated paper. In addition, the authors of the paper will be encouraged to add an Artifact Appendix of up to two pages to their publication. The goal of the appendix is to describe and document the artifact in a standard format.

Review and Anonymity

Artifact evaluation is “single-blind.” The identities of artifact authors will be known to members of the AEC, but authors will not know which members of the AEC have reviewed their artifacts.


To maintain the anonymity of artifact evaluators, the authors of artifacts should not embed any analytics or other tracking in the websites for their artifacts for the duration of the artifact-evaluation period. This is important to maintain the confidentiality of the evaluators. In cases where tracing is unavoidable, authors should notify the AEC chairs in advance so that AEC members can take adequate safeguards.


At the same time, though the authors are visible to AEC, the submission of an artifact does not give the AEC permission to make its content public. AEC members may not publicize any part of your artifact during or after completing the evaluation, nor may they retain any part of it after evaluation. Thus, you are free to include models, data files, proprietary binaries, etc. in your artifact. Participating in artifact evaluation does not require you to later publish your artifacts (although it is encouraged).

Submission Instructions

The SIGCOMM 2026 conference's artifact evaluation welcomes submissions from all accepted papers. Authors of the accepted papers can submit their artifacts via the SIGCOMM '26 AE submission site. Please register here by putting the paper's title, author names and the camera-ready version of the pdf. The registration deadline is August 8, 2026.

Packaging Artifacts

The AEC will accept any kind of digital artifact that authors wish to submit: software, data sets, survey results, test suites, mechanized proofs, etc. Physical objects, e.g., computer hardware, cannot be accepted due to the difficulty of making the objects available to members of the AEC. (If your artifact requires special hardware, consider if/how you can make it available to evaluators online.)


A complete artifact package must contain:


For the submitted artifact, we recommend the authors to consider (one, or multiple, but not limited to) the following methods to package their artifacts:

Artifact Metadata and Conflicts

We define conflict of interest with an AEC member using the following principles:


The AEC chairs and members will review conflicts to ensure the integrity of the reviewing process, adding or removing conflicts where necessary and sanity-checking cases where conflicts do not appear justified. Improperly identifying AEC members as a conflict to avoid individual reviewers may lead to your artifact submission being rejected. If you have concerns, please contact the AEC chairs.

Artifacts with Malicious Operations

Some artifacts may attempt to perform malicious or destructive operations by design. These cases should be boldly and explicitly flagged in detail in the README so the AEC can take appropriate precautions before installing and running these artifacts. Please contact AEC co-chairs if you believe that your artifacts fall into this category.

Further Advice

There are several sources of good advice about preparing artifacts for evaluation. These two are particularly noteworthy:

Organizers

Contact the Artifact Evaluation Chairs

Artifact Evaluation Co-ChairsInstitution
Guyue (Grace) LiuPeking University
Adithya Abraham PhilipCarnegie Mellon University
Sushovan DasETH Zurich
Committee MembersInstitution
Abd AlRhman AlQiamPurdue University
Aditya PeerIndraprastha Institute of Information Technology, Delhi
Afsara BenazirUniversity of Virginia
Ajay JoshiSnowflake
Amit SamantaUniversity of Utah
Andrew FergusonUniversity of Edinburgh
Antoine BertonElba Security
Ayush BansalUniversity of Illinois Urbana-Champaign
Baicheng ChenUC San Diego
Cesar A. StuardoBytedance Inc.
Chandan BothraAmazon Prime Video
Changhan GeAT&T Labs
Chris MisaUniversity of Oregon
Dan WangXi’an Jiaotong University
David de Andres HernandezIMDEA Networks Institute
Deepanjali MishraCarnegie Mellon University
Di ZhuUniversity of Virginia
Dipsy DesaiUniversity of Southern California
Gaosheng LiuUniversity of Trento
Hanfei YuStevens Institute of Technology
Hemant SethiCrusoe
Jiaqi LouUniversity of Illinois Urbana-Champaign
Jingyi LanTsinghua University
Jinwei ZhaoUniversity of Victoria, Canada
Kaiyang ZhaoNVIDIA
Lukas RollinETH Zurich
Marc KoernerEnergy Sciences Network (ESnet)
Mariam KiranOak Ridge National Lab
Md. Mahir AshhabUniversity of Virginia
Neha SinghMicrosoft
Peng JiangSoutheast University
Qiang SuXiamen University
Rostand A. K. FezeuGeneral Motors R&D
Sachidananda SinghHims & Hers
Sachin AshokUniversity of Illinois Urbana-Champaign
Seoyul OhUniversity of Illinois Urbana-Champaign
Seyyidahmed Jahmerimec
Shaunak GalyankarSanta Clara University
Sheng YaoThe Hong Kong University of Science and Technology
Shubham ChaudharyIIIT Delhi
Sibendu PaulApplied Scientist at Amazon Prime Video
Siddhant RayUniversity of Chicago
Srikar VanavasamUniversity of Illinois Urbana-Champaign
Sumit KumarIIIT Delhi
Tingting XuShenzhen University
Tommaso BonatoETH Zurich
Tony ZhangDatabricks
Umakant KulkarniNokia Bell Labs
Venkat Sai Suman Lamba KaranamBowling Green State University
Wei LiuZhongguancun Laboratory
Wenkai LiXi’an Jiaotong University
Wenlong DingThe Chinese University of Hong Kong
Wenqing LuoApple
Wenxue LiAlibaba
Xiaoqi ChenPurdue University
Xin Zhe KhooiNational University of Singapore
Xudong LiaoNetprem
Yiren ZhaoPrinceton University
Yucheng YinConviva
Yun WangShanghai Jiao Tong University
Zeying ZhuUniversity of Maryland
Zhenghang RenNVIDIA