ACM SIGCOMM 2018, Budapest, Hungary
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ACM SIGCOMM 2018 Workshop on IoT Security and Privacy (IoT S&P)

Call for Papers

Motivated by an increasing number of attacks and information leaks, IoT device manufactures, cloud providers, and researchers are working to design systems to secure to control the flow of information between devices, to detect new vulnerabilities; and to provide security and privacy within the context of user and the devices. While researchers continue to tackle IoT security and privacy, many questions remain open. Further, with the growing adoption of IoT devices, we will see a growth in the number of security and privacy issues. The goal of the Second ACM SIGCOMM Workshop on IoT S&P is to bring together academic and industry researchers from the security and networking communities to design, measure, and analyze secure and privacy enhancing systems for IoT devices.

We encourage the submission of work-in-progress papers in the area of design, implementation, management, and deployment of secure and private IoT frameworks as well as measurement and analysis of the privacy and security of existing IoT devices and packages.

List of Topics

We look for submissions of previously unpublished work on topics including, but not limited to, the following:

  • Network architectures and protocols for scalable, robust, secure, and privacy enhancing IoT
  • Network services and management for IoT
  • Security and privacy issues in IoT
  • Measurement of IoT privacy leakage
  • Measurement of industrial IoT
  • Usable security and privacy frameworks for home networks
  • Threat models and attack strategies in IoT
  • Intrusion and malware detection
  • Security architectures for the IoT stack
  • System and data integrity
  • Identity and access management in IoT
  • Trustworthiness in IoT
  • Secure operating systems in IoT
  • Automated armoring and patching
  • Cross-layer IoT security
  • IoT ecosystem-level security analysis
  • Clean-slate IoT security design

Submission Instructions

Submitted papers must not substantially overlap papers that have been published or that are simultaneously submitted to a journal or a conference with proceedings. Submissions should be at most 6 pages in the 10pt ACM double-column format, excluding well-marked appendices, and references. Submissions are not required to be anonymized. The template for the ACM double-column format can be found here: https://www.acm.org/publications/proceedings-template

Submissions are to be made to the submission web site at https://sigcomm18iotsp.hotcrp.com/. Only PDF files will be accepted. Submissions not meeting these guidelines risk rejection without consideration of their merits.

Authors Take Note

The official publication date is the date the proceedings are made available in the ACM Digital Library. This date may be up to TWO WEEKS prior to the first day of the conference. The official publication date affects the deadline for any patent filings related to published work.

Registration

Attendance of the workshop is by open registration and subject to the same registration fees and rules as all the other SIGCOMM 2018 workshops. The registrants of the workshop may freely attend any workshop on the same day.

Important Dates

  • August 20, 2018

    Workshop

  • Mid-June, 2018

    List of organization details

  • Mid-June, 2018

    Program available online

  • May 31, 2018

    Camera-ready deadline

  • April 30, 2018

    Paper acceptance notification

  • April 07, 2018

    Submission deadline

  • April 07, 2018

    Abstract submission deadline

Committees

  • Workshop Chairs
  • Theophilus Benson

    Brown, USA

  • Srikanth Sundaresan

    Facebook, USA

  • Program Committee Members
  • Cardenas Alvaro

    UTD, USA

  • Nitin Agrawal

    Samsung, USA

  • Landon Cox

    Duke, USA

  • Jon Crowcroft

    Cambridge, UK

  • Haixin Duan

    Tsinghua, China

  • Nick Feamster

    Princeton, USA

  • Earlence Fernandes

    UW, USA

  • Phillipa Gill

    UMass, USA

  • Hamed Haddadi

    Imperial, UK

  • Emir Halepovic

    AT&T, USA

  • Shuang Hao

    UTD, USA

  • Hongxin Hu

    Clemson, USA

  • Bruce Maggs

    Duke and Akamai, USA

  • Amir Rahmati

    Samsung and Stony Brook, USA

  • Sayandeep Sen

    IBM, India

  • Zubair Shafiq

    UIowa, USA

  • Seungwon Shin

    KAIST, South Korea

  • Vijay Sivaraman

    UNSW, Australia

  • Narseo Vallina-Rodriguez

    IMDEA, Spain

  • Ying Zhang

    Facebook, USA

  • Ben Zhao

    UChicago, USA

  • Zachary Bischof

    IIJ, Japan

Contact the IoT S&P chairs